Backend Process Development has been the core to enable new packaging solutions to address new requirements from Infineon’s customers. Depending on the complexity of the projects, this may take significant amount of the project time, thus adding the lead time needed for the new package to be released to the market. Combining the data from process machines, where real-time data are collected during the fabrication of the units, with input parameters of the chips and Bill Of Materials (BOM), as well as the output measurements, an AI model could be developed for future process development with similar configuration. The model should provide prediction on output responses given a set of input parameters, which may substitute the early stage of process development such as feasibility of Proof of Concept (POC) and Design Of Experiments (DOE).
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